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Sub-Micron Die Bonder

UNIVERSITY OF SHEFFIELD Published 9 Dec 2025 Find a Tender

key details

Statusplanning
Category (CPV) 38000000
RegionYorkshire and the Humber
SME suitableYes
OCIDocds-h6vhtk-05f213

description

We are seeking equipment that can provide a wide range of bonding technologies to cater for semiconductor die to wafer, die to chip, wafer to wafer, fli-chip and other semiconductor chiplet bonding, to support our work in Heterogeneous Integration for Microelectronics and Semiconductor Systems.

notice history

1 notice published against this procurement.

PublishedTypeRegimeNotice
9 Dec 2025 Preliminary market engagement (UK2) Procurement Act 2023 081169-2025

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source

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