NMIS Power Electronics Advanced Packaging Semiconductor Facility, dedicated die bonding, wire bonding, and encapsulation equipment.
key details
| Value | £1,900,000 |
|---|---|
| Status | complete |
| Category (CPV) | 31712330 +1 more |
| Region | Scotland |
| Deadline | 5 Feb 2024 |
| Procedure | open |
| OCID | ocds-h6vhtk-03f66f |
Award
| Supplier | Value | Date | Status |
|---|---|---|---|
| Accelonix | · | · | active |
description
NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The initial focus will be procuring equipment to support die bonding, wire bonding and encapsulation and associated ancillaries required.
notice history
3 notices published against this procurement.
| Published | Type | Regime | Notice |
|---|---|---|---|
| 23 Aug 2023 | Prior information notice (F01) | Earlier regulations | 024848-2023 |
| 20 Dec 2023 | Contract notice (F02) | Earlier regulations | 037383-2023 |
| 3 Jul 2024 | Contract award notice (F03) | Earlier regulations | 020273-2024 |
more from University of Strathclyde
- Provision of UNIT4 FMS Maintenance and Support · 28 Jul 2026
- Provision of Travel Management Services · £24,000,000 · 23 Jul 2026
- Provision of an Intruder & Disabled Toilet Alarm Maintenance Measured Term Contract (MTC) (2026-30) · 23 Jul 2026
- Supply, Delivery and Installation of Power Semiconductor Reliability Testing Equipment · £1,000,000 · 20 Jul 2026
- Strathclyde Pharma Solutions Equipment Service & Maintenance · £120,000 · 16 Jul 2026
- Gladstone Leisure Management System and Associated Services · 8 Jul 2026
- Wharton Data Research Services (WRDS) Platform · 8 Jul 2026
- Bloomberg Financial Trading Terminals · 8 Jul 2026
all contracts from this buyer →
similar contracts awarded
Other awarded contracts in the same category. Useful for seeing who normally wins this kind of work, and at what value.
- Supply, Delivery, Installation & Commissioning of a Wafer Thinning Turnkey ITT · University of Strathclyde · £2,000,000
- Supply, Delivery and Installation of wafer dicing kit for NMIS · University of Strathclyde · £1,000,000
- Supply, Delivery and Installation of Laser Depanelling & Singulation · University of Strathclyde · £825,000
- GSS23859 - Test Structure Fabrication · UK SHARED BUSINESS SERVICES LIMITED · £16,453
- GB-Swindon: UKRI-3064 Hexagon 4'' Silicon Wafers · UK Research & Innovation · £52,662
- FM22309 - Mask Change · UK SHARED BUSINESS SERVICES LIMITED · £19,397
- GB-Swindon: UKRI-1890 UHV Sample Manipulator · UK Research and Innovation · £31,042
- Supply of Multicomponent Next Generation Semiconductor Materials and Device Fabrication Cluster Tool Set (McCTS) · Swansea University · £500,000
source
Published on Find a Tender. Contact details for named individuals are not reproduced on this site.