Supply, Delivery and Installation of Power Semiconductor Reliability Testing Equipment
key details
| Value | £1,000,000 |
|---|---|
| Status | active |
| Category (CPV) | 38000000 |
| Region | Scotland |
| Deadline | 19 Aug 2026 |
| Procedure | open |
| OCID | ocds-h6vhtk-06cea6 |
description
Background
The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption.
The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products.
NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology – reducing time-to-market and anchoring value onshore.
Description
This tender is to ensure that the devices packaged by the facility or our clients meet industry standards, the facility is planning to procure three reliability testing equipment/systems as follows:
- Climatic chamber 1 for high temperature bias test,
- Climatic chamber 2 for high temperature and high humidity bias test,
- Thermal shock test chamber.
documents
- Supply, Delivery and Installation of Power Semiconductor Reliability Testing Equipment , contractNotice
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notice history
1 notice published against this procurement.
| Published | Type | Regime | Notice |
|---|---|---|---|
| 20 Jul 2026 | Contract notice (F02) | Earlier regulations | 068163-2026 |
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source
Published on Public Contracts Scotland. Contact details for named individuals are not reproduced on this site.