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Supply, Delivery and Installation of wafer dicing kit for NMIS

University of Strathclyde Published 16 Jan 2025 Public Contracts Scotland

key details

Value£1,000,000
Statuscomplete
Category (CPV) 31712330
RegionScotland
Deadline22 Jul 2024
Procedureopen
OCIDocds-h6vhtk-047100

Award

SupplierValueDateStatus
S3 Alliance Ltd · · active

description

The National Manufacturing Institute Scotland is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that can support a wide variety of power electronic semiconductor designs and packaging requirements. The concept design for the facility will support a publicly funded project which will see the creation of an advanced facility for developing and scaling-up packaging capabilities and includes provision of equipment that is sufficiently flexible to support a wide variety of power electronic semiconductor design and packaging requirements.

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notice history

2 notices published against this procurement.

PublishedTypeRegimeNotice
19 Jun 2024 Contract notice (F02) Earlier regulations 018851-2024
16 Jan 2025 Contract award notice (F03) Earlier regulations 001435-2025

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source

Published on Public Contracts Scotland. Contact details for named individuals are not reproduced on this site.