Die Bonding System
key details
| Value | £215,000 |
|---|---|
| Status | active |
| Category (CPV) | 38000000 |
| Deadline | 16 Jul 2026 |
| Contract start | 27 Jul 2026 |
| Contract end | 31 Aug 2027 |
| Procedure | open |
| SME suitable | Yes |
| OCID | ocds-b5fd17-70b4946f-879f-4cc8-b8ca-342875acc7bf |
description
Funding is available to purchase a die attach/bonding system capable of performing a wide range of bonding processes, including ultrasonic, flip-chip, and UV curing, which is suitable for prototyping and light production runs. As a result, a crucial aspect for any die attach system under is the ability to be used for bonding runs as small as a single die should this be required. This stipulation lends itself to a semi-automated (i.e. motorised) system, ideally with the capacity to store process recipes to maximise reproducibility should the system be used for light production runs.
documents
- https://tenders.bris.ac.uk
- https://www.contractsfinder.service.gov.uk/Notice/21933349-7465-49c1-a0c0-59f1caeb33ed , tenderNotice
Documents are linked, not mirrored. They are served by the publishing authority and may require registration.
notice history
1 notice published against this procurement.
| Published | Type | Regime | Notice |
|---|---|---|---|
| 1 Jul 2026 | Tender (tender) | · | 21933349-7465-49c1-a0c0-59f1caeb33ed-904105 |
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source
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