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Supply, Delivery and Installation of High Accuracy Motion Control and Imaging System

University of Strathclyde Published 5 Aug 2026 Public Contracts Scotland

key details

Statusactive
Category (CPV) 38000000
RegionScotland
Deadline7 Sept 2026
Procedureopen
OCIDocds-h6vhtk-06dcdb

description

Background

The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption.

The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products.

NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology – reducing time-to-market and anchoring value onshore.

Description

The University of Strathclyde has a requirement for a High Accuracy Motion Control and Imaging System.

documents

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notice history

1 notice published against this procurement.

PublishedTypeRegimeNotice
5 Aug 2026 Contract notice (F02) Earlier regulations 074374-2026

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source

Published on Public Contracts Scotland. Contact details for named individuals are not reproduced on this site.