Supply, Delivery and Installation of wafer dicing kit for NMIS
key details
| Value | £1,000,000 |
|---|---|
| Status | complete |
| Category (CPV) | 31712330 |
| Region | Scotland |
| Deadline | 22 Jul 2024 |
| Procedure | open |
| OCID | ocds-h6vhtk-047100 |
Award
| Supplier | Value | Date | Status |
|---|---|---|---|
| S3 Alliance Ltd | · | · | active |
description
The National Manufacturing Institute Scotland is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that can support a wide variety of power electronic semiconductor designs and packaging requirements. The concept design for the facility will support a publicly funded project which will see the creation of an advanced facility for developing and scaling-up packaging capabilities and includes provision of equipment that is sufficiently flexible to support a wide variety of power electronic semiconductor design and packaging requirements.
documents
- Supply, Delivery and Installation of wafer dicing kit for NMIS , awardNotice
- Supply, Delivery and Installation of wafer dicing kit for NMIS , contractNotice
Documents are linked, not mirrored. They are served by the publishing authority and may require registration.
notice history
2 notices published against this procurement.
| Published | Type | Regime | Notice |
|---|---|---|---|
| 19 Jun 2024 | Contract notice (F02) | Earlier regulations | 018851-2024 |
| 16 Jan 2025 | Contract award notice (F03) | Earlier regulations | 001435-2025 |
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source
Published on Public Contracts Scotland. Contact details for named individuals are not reproduced on this site.