CSP25458 - Compact wafer bonder
key details
| Status | complete |
|---|---|
| Procedure | limited |
| OCID | ocds-h6vhtk-05d140 |
Award
| Supplier | Value | Date | Status |
|---|---|---|---|
| PI-KEM Ltd | · | · | active |
description
***** THIS IS A CONTRACT DETAILS NOTICE, NOT A CALL FOR COMPETITION ***** This procurement is being concluded following a limited competition procurement exercise. Contract details notice for the supply of Compact Vacuum Hot Flat Press for Wafer Bonding, Dry & Oil-Free Scroll Pump, Digital temperature controlled recirculating water chiller and delivery to UKRI
notice history
1 notice published against this procurement.
| Published | Type | Regime | Notice |
|---|---|---|---|
| 22 Oct 2025 | Contract details (UK7) | Procurement Act 2023 | 067332-2025 |
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source
Published on Find a Tender. Contact details for named individuals are not reproduced on this site.