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Supply, Delivery and Installation of Sinter Bonding Capability

University of Strathclyde Published 13 May 2026 Find a Tender

key details

Value£900,000
Statuscomplete
Category (CPV) 38000000
RegionScotland
Deadline26 Jan 2026
Procedureopen
OCIDocds-h6vhtk-05f82e

Award

SupplierValueDateStatus
Inseto UK Limited · · active

description

National Manufacturing Institute Scotland (NMIS) is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. A solution is required to form sintered bonds between: dies on substrates in multi-die packages with different component heights; substrates on heat sinks; clips, spacers and interconnection parts; double-sided cooling packages.

documents

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notice history

3 notices published against this procurement.

PublishedTypeRegimeNotice
20 Oct 2025 Prior information notice (F01) Earlier regulations 066666-2025
17 Dec 2025 Contract notice (F02) Earlier regulations 083991-2025
13 May 2026 Contract award notice (F03) Earlier regulations 043912-2026

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source

Published on Find a Tender. Contact details for named individuals are not reproduced on this site.