Die Bonder

The Compound Semiconductor Applications Catapult is looking to create a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and Power compound semiconductor devices, modules and systems. This would allow experimentation, feasibility, proof of concept and small prototype volume build.

As part of the package assembly research and development methodology we require a machine to perform die bonding on to package, module and PCB boards.

The bonding equipment shall allow manual and semi-automatic bonding for experimentation and low volume prototype build. It shall be adaptable to bond a wide variety of components from chip level through to module level using organic-inorganics substrates, a variety of adhesives, and PCBs for all required package architectures required for Photonics, Power, and RF, e.g. standard industry package units; multi-chip modules and System-in-Package solutions.

The system will be in the CSA Catapults Innovation Centre, within the Advanced Packaging Laboratory, which will be equipped with access to all power and services for full installation and operation.

The Catapult may also purchase additional, related services.

Additional information: To express interest in this opportunity and receive the tender documents, please email procurement@csa.catapult.org.uk with ITC-2019-027 in the subject field.