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UKRI-3441 Ball Bonder for Studding and Wire Bonding of Microelectronic Components

UK Research & Innovation Published 15 Feb 2024 Contracts Finder

key details

Value£180,000
Statusunsuccessful
Category (CPV) 31712000
RegionSouth East
Deadline19 Jan 2024
Procedureopen
OCIDocds-h6vhtk-0422ea

Awards (3)

This procurement was awarded to 1 suppliers. Values shown are per-award; the notice total is £180,000.

SupplierValueDateStatus
Inseto (UK) Limited £250,000 13 Feb 2024 active
Inseto (UK) Limited · · active
not named · · unsuccessful

description

UK Research and Innovation's (UKRI) Science and Technology Facilities Council (STFC) wishes to establish a Contract for the provision of a Ball Bonder for Studding and Wire Bonding of Microelectronic Components.

documents

Documents are linked, not mirrored. They are served by the publishing authority and may require registration.

notice history

5 notices published against this procurement.

PublishedTypeRegimeNotice
8 Dec 2023 Contract notice (F02) Earlier regulations 036273-2023
8 Dec 2023 Tender (tender) · f4f683a2-81dd-4842-bc8a-712315908f69-705696
15 Feb 2024 Contract award notice (F03) Earlier regulations 005139-2024
15 Feb 2024 Contract award notice (F03) Earlier regulations 005140-2024
15 Feb 2024 Award (award) · ff94b41f-0998-4aa9-88d6-98f74526d0de-723867

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source

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