UKRI-3441 Ball Bonder for Studding and Wire Bonding of Microelectronic Components
key details
| Value | £1 |
|---|---|
| Status | active |
| Category (CPV) | 31712000 |
| Region | South East |
| Deadline | 19 Jan 2024 |
| Contract start | 9 Feb 2024 |
| Contract end | 8 Feb 2025 |
| Procedure | open |
| SME suitable | Yes |
| OCID | ocds-b5fd17-1b166821-9c1f-4ff6-9d40-37e9de92f6c4 |
description
UK Research and Innovation's (UKRI) Science and Technology Facilities Council (STFC) wishes to establish a Contract for the provision of a Ball Bonder for Studding and Wire Bonding of Microelectronic Components.
documents
- https://www.contractsfinder.service.gov.uk/Notice/7ae3de7f-fb7f-46f9-a438-61fa3bab3a65 , tenderNotice
- https://www.delta-esourcing.com/delta/respondToList.html?noticeId=842499336 , tenderNotice
Documents are linked, not mirrored. They are served by the publishing authority and may require registration.
notice history
1 notice published against this procurement.
| Published | Type | Regime | Notice |
|---|---|---|---|
| 21 Feb 2024 | Tender (tender) | · | 7ae3de7f-fb7f-46f9-a438-61fa3bab3a65-723821 |
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source
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