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Supply, Delivery and Installation of Power Semiconductor Reliability Testing Equipment

University of Strathclyde Published 20 Jul 2026 Public Contracts Scotland Open until 19 Aug 2026

key details

Value£1,000,000
Statusactive
Category (CPV) 38000000
RegionScotland
Deadline19 Aug 2026
Procedureopen
OCIDocds-h6vhtk-06cea6

description

Background

The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption.

The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products.

NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology – reducing time-to-market and anchoring value onshore.

Description

This tender is to ensure that the devices packaged by the facility or our clients meet industry standards, the facility is planning to procure three reliability testing equipment/systems as follows:

  1. Climatic chamber 1 for high temperature bias test,
  2. Climatic chamber 2 for high temperature and high humidity bias test,
  3. Thermal shock test chamber.

documents

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notice history

1 notice published against this procurement.

PublishedTypeRegimeNotice
20 Jul 2026 Contract notice (F02) Earlier regulations 068163-2026

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source

Published on Public Contracts Scotland. Contact details for named individuals are not reproduced on this site.