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Supply, Delivery and Installation of a Wafer Dicing Saw

University of Strathclyde Published 6 Mar 2019 Public Contracts Scotland

key details

Value£55,000
Statuscomplete
Category (CPV) 51430000
RegionScotland
Deadline4 Feb 2019
Procedureopen
OCIDocds-r6ebe6-0000570660

Award

SupplierValueDateStatus
Disco Hi-Tech UK Ltd · · ·

description

The Department of Physics at the University of Strathclyde requires a wafer dicing saw. The wafer dicing saw will be used primarily for dicing 150 mm diameter wafer stacks of glass and silicon.

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source

Published on Public Contracts Scotland. Contact details for named individuals are not reproduced on this site.