Analysis of Ceramic to Metal bonding

The objective of this work package is to analyse the ceramic to metal bonding used in microwave components that form vacuum barriers. There are a variety of bonds to be investigated ranging from microwave vacuum windows that have low negligible thermal or mechanical loads, to components in high power microwave sources that are subject to high thermal loads that then induce mechanical strain from the induced thermal gradients. The analysis will focus on pre-and post-cyclic fatigues tested components to evaluate the integrity of the bonding joint for its vacuum and thermal conductivity integrity. In some components, the use of SEMs capable of monitoring the bond during temporal loading will be required.

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