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Supply of Semiconductor Dicing and Grinding Systems

Swansea University Published 8 Nov 2021 Find a Tender

key details

Value£350,000
Statuscomplete
Category (CPV) 38000000
RegionWales
Deadline24 Aug 2021
Procedureopen
OCIDocds-h6vhtk-02cb8f

Award

SupplierValueDateStatus
Disco HI-TEC UK LTD · · active

description

This Tender Specification is for the supply and installation of a Wafer Dicing System and a Wafer Grinding System. These systems will be of strategic importance in expanding the capabilities that the CISM will be able to provide, and reliability of the equipment is paramount to maintaining and supporting the wide array of experimental work that will be conducted within the facility.

This requirement is split into two separate lots

notice history

2 notices published against this procurement.

PublishedTypeRegimeNotice
23 Jul 2021 Contract notice (F02) Earlier regulations 017441-2021
8 Nov 2021 Contract award notice (F03) Earlier regulations 027974-2021

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source

Published on Find a Tender. Contact details for named individuals are not reproduced on this site.