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Thermal Chuck and Chiller System

COMPOUND SEMICONDUCTOR APPLICATIONS CATAPULT LIMITED Published 20 Dec 2018 Contracts Finder

key details

Value£80,000
Statusactive
Category (CPV) 31710000 +1 more
Deadline7 Jan 2019
Contract start25 Jan 2019
Contract end23 Jan 2022
Procedureopen
SME suitableYes
OCIDocds-b5fd17-0efdaff4-5c5b-44ec-bc67-98e52bd01b94

description

The Compound Semiconductor Applications Catapult is procuring a Thermal Chuck and Chiller System suitable for integration with a 200mm high power, semi-automated probe station.

The Catapult may also purchase additional related services.

Additional information: To express interest in this opportunity and receive the tender documents, please email procurement@csa.catapult.org.uk with ITC-2018-024 in the subject field.

documents

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notice history

1 notice published against this procurement.

PublishedTypeRegimeNotice
20 Dec 2018 Tender (tender) · e7d06789-c0df-47f3-90eb-c7e70d644912-260497

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