GB-LIVERPOOL: Manual Die Placement System for Glueing & Bump Bonding

Tender for the supply of a die bonding system suitable for the glueing of silicon dies with epoxy and filled anisotropically conductive glues as well as for bump bonding with Indium, PbZn and AgZn solder balls. The system will be housed in the Liverpool Semiconductor Detector Centre (LSDC), Department of Physics, University of Liverpool.

Additional information: The contracting authority considers that this contract may be suitable for economic operators that are small or medium enterprises (SMEs). However, any selection of tenderers will be based solely on the criteria set out for the procurement.Please note the return date is 19/01/2016 at 12 noon and the documentation is located on the following web site https://in-tendhost.co.uk/liverpooluni Select ‘Tenders’ from the top menu bar, select ‘current’, then click ‘view details’ button. To gain full access to this website and documentation you need to log in using your existing registration details or click the ‘Register’ button if you have not registered before. When registering PLEASE make sure the ‘publish e-mail address’ field is completed accurately as this will receive all automated correspondence. Please return your submission as detailed in the document. All dates, time periods and quantities indicated in this Notice are provisional only and the university reserves the right to change the same if circumstances so dictate. The University reserves the right not to enter in to any contract pursuant to this Notice and to withdraw from this procurement exercise at any time.