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Die Bonding System

University of Bristol Published 1 Jul 2026 Contracts Finder

key details

Value£215,000
Statusactive
Category (CPV) 38000000
Deadline16 Jul 2026
Contract start27 Jul 2026
Contract end31 Aug 2027
Procedureopen
SME suitableYes
OCIDocds-b5fd17-70b4946f-879f-4cc8-b8ca-342875acc7bf

description

Funding is available to purchase a die attach/bonding system capable of performing a wide range of bonding processes, including ultrasonic, flip-chip, and UV curing, which is suitable for prototyping and light production runs. As a result, a crucial aspect for any die attach system under is the ability to be used for bonding runs as small as a single die should this be required. This stipulation lends itself to a semi-automated (i.e. motorised) system, ideally with the capacity to store process recipes to maximise reproducibility should the system be used for light production runs.

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notice history

1 notice published against this procurement.

PublishedTypeRegimeNotice
1 Jul 2026 Tender (tender) · 21933349-7465-49c1-a0c0-59f1caeb33ed-904105

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