904 - Compound Semiconductor Plasma Processing Equipment
key details
| Value | £1,200,000 |
|---|---|
| Status | active |
| Category (CPV) | 38000000 |
| Deadline | 12 Jan 2024 |
| Contract start | 1 Nov 2024 |
| Contract end | 31 Oct 2028 |
| Procedure | open |
| SME suitable | Yes |
| OCID | ocds-b5fd17-5591d796-f4b0-448b-bf31-74bb59c2bb93 |
description
The College of Engineering and Physical Sciences (EPS) at Aston university is creating a III-V semiconductor fabrication facility. As a consequence, we are seeking a single supplier to provide a suite of plasma processing tools for:
- ICP Etch of semiconductor materials (e.g. GaAs, GaN, InP, GaSb)
- RIE Etch of dielectric materials (e.g. SiO2, SiNx) and metals (e.g. Au, Ge, Cr, Ti, Pt, Pd)
- Deposition of dielectric layers (e.g. SiO2, SiNx)
The full project specific requirements and equipment specification can be found within the project question set on Aston University's e-tendering portal ProContract under Section 11 - Project Specific Requirements.
documents
- https://procontract.due-north.com/Advert?advertId=3015b2a6-2b8e-ee11-8125-005056b64545
- https://www.contractsfinder.service.gov.uk/Notice/6be2440e-7977-4792-b353-44a668924856 , tenderNotice
Documents are linked, not mirrored. They are served by the publishing authority and may require registration.
notice history
2 notices published against this procurement.
| Published | Type | Regime | Notice |
|---|---|---|---|
| 28 Nov 2023 | Contract notice (F02) | Earlier regulations | 035128-2023 |
| 28 Nov 2023 | Tender (tender) | · | 6be2440e-7977-4792-b353-44a668924856-702584 |
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source
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